1.About the application field of COG bonding machine XCG93-C1(the pressure).

COG bonding equipment (the pressure) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as. mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.

2.Basic parameters of XCQ77-A1

Input Power. AC220V 50-60HZ

Vacuum control. vacuum + vacuum generator;

Dimensions. L1000 * W1050 * H1475mm (excluding warning lights)

Operating modes. 7-inch HMI

Control system (LG-LS). a programmable processor

Pressure gauge. KITA, the number of explicit

Pressure regulator. Japan SMC, precision pressure regulating valve

Pressure accuracy. ± 0.5% full in the degree

Sensitivity. 0.2% full in the degree

Pressure Unit. Kg / N / Mpa / Kpa swap

counterpoint mode. CCD next counterpoint

Platform Work. Fixed

Platform Material. high quality Bakelite

Heating. heating thermostat

Thermocouple. K type

Blade material. 440C

Temperature range. RT-500

3.About the functions and characteristics of COG bonding machine XCG93-C1(the pressure).

3.1 heating curve with digital temperature display synchronization.

3.2 can store 500 groups of function parameters.

3.3 thermocouple output parameters can be adjusted according to the head power.

3.4 SUNSOM twin eliminate structural weight, pressure accurate.

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Shenzhen Sunsom automatic equipment Co.,Ltd .

is a high-tech enterprise specialized in R&D,manufacturing and sales of LCD automatic equipment.we stick to the the enterprise spirit of " efficiency and practicality",have successfully developed，

Constant Heat Bonding Machine,Pulse Heat Bonding Machine ,ACF Taking Machine,automation bubble-removing Machine,Polarizer Delaminator,HSC Bonding Machine ,large size TFT Bonding Machine ,PDP Bonding Machine,COG Alignment Machine,COG Bonding Machine,COG Previous Testor,COG Final Testor,ITO Tester,Opencell Testor and etc.These machines are widely applied to flat panel TFT/LCD .PDA,PDA;soldering of FPC and FFC to PCB ;polarizer removing,polarizer laminating,ACF laminating,polarizer claving process as well as various flat panel displays bonding and connecting process.